Career Page Contact us
ASIC Design
ASIC Design Solutions IP Platforms IPs and Capabilities
Semiconductor Services
Semiconductor Services Qualification & Failure Analysis Package Design Semiconductor Manufacturing Test Services Foundry Tape-Out Services
About Global Chip Design
About Global Chip Design Management Team Sustainability Quality and Certifications Partners Ecosystem Career Page
News & Resources
News & Articles Technical Resources Events

Semiconductor Production


A strong experience in producing semiconductors,
rooted in long history

Global Chip Design operates a global, flexible, and dedicated supply chain system, allowing to secure its customers every year. 

 

 

Our on-staff team provides the following skillset to your business:

We consolidated all production-related functions into integrated teams of experts who are focused on getting your product to your customers or your internal operations as seamlessly as possible.

Supplier management

Selection
Qualification
Audit
Contracts
Regular business review and solid partnership

Planning

End-to-end supply/demand reconciliation
Forecasting
Lot starts
Inventory optimization

Purchasing

Order placement
Backlog
Management
WIP tracking

Logistics

Shipment
Custom clearance
Discover more about our services

From design to test and qualification to production

Logistics

 

Our local partners provide packaging/assembly operations so we can process lots under the same roof, from probe test to wafer backend, assembly, final test, and finishing.

We leverage our Hong Kong-based warehouse for efficient and cost-effective world-wide logistics as well as facilitated access to Asian EMS or end-markets.

 

Additionally, we have internal expertise sustaining your product’s ongoing production, yield, and quality, including:

  • Quality engineers: RMA process, customer interaction, G8D management

  • Product engineers: yield trend management, interface with design, product ownership

  • Device engineers: yield analysis, foundries interfacing, PCR management, corrective actions

  • Failure Analysis engineers: RMA analysis, reporting, root cause analysis, field returns (ppm)

  • Test engineers: test coverage - escape resolution, test time reduction

Want to know how Global Chip Design can help you with your next project ?

Contact us