We provide reliable foundry access and full tape-out support to bring your design to silicon — securely, efficiently, and on schedule. We ensure your design is submitted securely, efficiently, and in full compliance with foundry requirements. Whether you're developing a custom IC or integrating silicon into a larger system, we provide foundry access with the right technology node, managed from start to finish.
Global Chip Design provides tape out service at the most important Asian silicon fabs. We can offer MPW tape out for prototyping and testing of your IC or IP design and mask set tape out for mass production. Also, assembly service in various package types by using high quality and well-known assembly houses facilities can be provided as well.
We collaborate directly with major foundries to offer a wide range of technologies, including automotive-qualified, high-voltage, RF, and ultra-low-power processes, including:
CMOS - 18 nm, 13 nm, 9 nm, 65/55nm, 40nm, 28nm, 22nm, 12nm
Mixed Signal / BCD – 180m, 130nm, 55nm, 28nm
We manage all technical and logistical aspects of the tape-out submission, including design rule compliance, secure hand-off, and foundry interface.