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IC Package Design

 

As we facilitate your design activity with foundries, we can also select, design, qualify, and produce your package based on your chip-to-package co-design requirements.

 

We work with high quality and well-known assembly houses, we know their possibilities and can suggest which fab meets your project requirements.

 

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Our expertise in IC Package Design

Our package engineers have experience in all lead frames and laminate-based, BGA to surface mount packages, smart card modules, and in-lays and flex circuits, as well as wafer-level packaging and bumping options for WLCSP optimal soldering.

We are also able to define, route and optimize the stack up substrate and lead frame form factor through simulation.

 

Utilizing our interface libraries and in-house design capabilities, we can provide you with the ideal substrate stack, lead frame setup, and construction materials. Furthermore, we can optimize the routing of multilayer and chiplets to improve the electrical, thermal, and reliability performance of your final package.

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Custom Package Solutions for Specific Applications

More often than not, packaging and System in a Package (SIP) requires a full custom package development to fit the application form factor constraint or operating condition from ultra-high voltage/current, optical spectrum and to environmental conditions.

Global Chip Design can create, integrate heterogeneous materials inside the package and qualify this extremely custom package solution and form factors for specific end market application requests from  Commercial and Industrial to Automotive Grade and Medical Class.

A proven Development Proprietary Process

 

Global Chip Design Advanced Packaging Design is supported by our Service Quality Planning proprietary process  making your project more predictable and reducing risk during development and ramp phases while providing both transparency and traceability.

Want to know how Global Chip Design can help you with your next project ?

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